1 product data sheet amphenol ? hdb 3 series high density mother board & daughter board connectors no. 201-3 rectangular interconnects with .070? x .060? grid spacing this new connector series incorporates a higher density contact pattern and lower mated height than amphenol?s original low mating force rectan- gular connectors while utilizing the same durable and reliable b 3 contact. the b 3 brush (bristle brush bunch) contact is comprised of multiple strands of high tensile wire that intermesh to create an electrical connection. amphenol hdb 3 mother board connector hdb 3 daughter board connector benefits of the brush contact ? redundant current paths: 14-70 gas tight points of contact per mated bunch ? very smooth low friction interface ? low mating forces: 1.5 oz. typical per contact, 70-90% lower than conventional contacts ? long contact life: 100,000 cycles of mating and unmating without performance degradation ? documented intermittency free performance: no 10 nano-second discontinuities during 50,000,000 cycles of 0.010? displacement ? impervious to fretting ? contact interface meets m55302/166 thru /171 @2009 amphenol corporation printed in u.s.a. 1/8/2009 hdb 3 features polarization: ?d? shaped design keying: op tional keys offer 36 unique keying combinations guide pins optional guide pins provide additional alignment radial misalignment: capable of correcting up to a .020" initial radial misalign- ment angular misalignment: capable of mating with up to a 2 initial angular misalignment hdb 3 connector performance durability: 100,000 mating cycles insertion/extraction force: 1.5 ounce typical per contact operating temperature: -65 to 150c current rating: 2 amperes hot swap 1 ampere maximum (load dependent) insulation resistance: 5 gigaohms minimum dielectric withstanding voltage: 750 volts, 60 hertz, rms @ sea level 250 volts, 60 hertz, rms @ 70,000 feet elevation solderability: mil-std-202, method 208 salt fog: 48 hours iaw mil-std-1344, method 1001, test condition b humidity: iaw mil-std-1344, method 1002, type ii vibration: 4 hours in each of 3 mutually perpendicular axes iaw mil-st 1344, method 2005, test condition v, letter h shock: 1 shock along each of three mutually perpendicular axes iaw mil-std-1344, method 2004, test condition g data rate: capable of 3.125 gbps (consult amphenol for arrangement)
2 .350 .350 .325 .086 min. dia. thru hole (us e no. 2 screw) pin 1 pin 1 ba .086 min. dia. thru hole (us e no. 2 screw) cb a .335 max. .150 .005 .150 .020 typ. .150 .020 typ. .016 .001 dia. typ. .016 .001 typ. .195 min. hex .070 min deep (use 3/16 hex head) .090 typ. .03 0 typ. .035 typ. .070 typ. .060 typ. .025 .540 .420 .350 .410 .470 .530 4 6 5 1 2 3 d f e a b c 1 2 3 6 5 4 a b c f e d hdb 3 materials insulator: liquid crystal polymer, 30% glass filled contact: w ire: beryllium copper per astm b197; finish is gold per astm b488 over nickel per ams-qq-n-290. holder: brass similar to uns c33500; finish is gold per mil-g-45204 or tin-lead per mil-p-81728 or tin per mil-t-10727 (rohs compliant). sleeve: stainless steel per ams-5514, passivated iaw qq-p-35 (daughter board connector only) keys/guide pins: stainless steel mother board daughter board all dimensions for reference only. custom configurations ? hybrid configurations are available with any combination of brush and power, coax, and/or fiber optic contacts ? partially populated arrangements for high voltage or high speed data transfer up to 3.125 gbps. (shown at right) consult amphenol aerospace with your design requirements. number of dimension dimension dimension contacts a b c 040 40 1.375 0.800 1.075 0 8 0 80 2.075 1.500 1.775 120 120 1.775 2.200 2.475 160 160 3.475 2.900 3.175
3 hdb 3 mother board connector how to order hdb-m4 - 040 m 20 2 x hdb-m4 designates hdb 3 mother board connectors number of contacts number of dimension dimension dimension contacts a b c 040 40 1.375 0.800 1.075 0 8 0 80 2.075 1.500 1.775 120 120 1.775 2.200 2.475 160 160 3.475 2.900 3.175 brush wire plating m 0.000050 au min. thick over nickel c 0.000020 au min. thick over nickel termination example part number: hardware type stickout (dim. k) x no hardware n/a g polarization key 0.250 qty. 2 h polarization key 0.500 qty. 2 j polarization key 0.750 qty. 2 t guide pin 0.250 qty. 2 u guide pin 0.500 qty. 2 v guide pin 0.750 qty. 2 type stickout (dim. e) 20 pcb, straight, .016 dia. 0.060 21 pcb, straight, .016 dia 0.090 22 pcb, straight, .016 dia 0.120 23 pcb, straight, .016 dia 0.150 24 pcb, straight, .016 dia 0.180 25 pcb, straight, .016 dia 0.210 contact terminition finish 2 gold plated in accordance with mil-g-45204, type ii, .00030 min. thick gold over .000050 min. thick nickel 5 tin plated in accordance with astm b545, .00010 min. thick matte tin over .00010 min. thick nickel 6 tin-lead plated in accordance with sae-ams-p-81728, .00010 min. thick tin-lead over .00010 min. thick copper hdb-m4-xxxxxxxx drawing is available on-line at www.amphenol-aerospace.com. then go to board level, then go to hdb3. type stickout (dim. e) 26 pcb, straight, .016 dia 0.240 27 pcb, straight, .016 dia 0.270 2 8 pcb, straight, .016 dia 0.300 29 pcb, straight, .016 dia 0.360 30 pcb, straight, .016 dia 0.420 hdb 3 daughter board connector how to order hdb-d4 - 040 m 02 2 x hdb-d4 designates hdb 3 daughter board connectors number of contacts number of dimension dimension dimension contacts a b c 040 40 1.375 0.800 1.075 0 8 0 80 2.075 1.500 1.775 120 120 1.775 2.200 2.475 160 160 3.475 2.900 3.175 brush wire plating m 0.000050 au min. thick over nickel c 0.000020 au min. thick over nickel termination example part number: hardware type x no hardware p polarization key qty. 2 l polarization key qty. 2 type stickout (dim. e) 00 pcb, right angle, .016 dia. 0.060 01 pcb, right angle, .016 dia. 0.090 02 pcb, right angle, .016 dia. 0.120 03 pcb, right angle, .016 dia. 0.150 04 pcb, right angle, .016 dia. 0.180 05 pcb, right angle, .016 dia. 0.210 06 pcb, right angle, .016 dia. 0.300 hdb-d4-xxxxxxxx drawing is available on-line at www.amphenol-aerospace.com. then go to board level, then go to hdb3. contact terminition finish 2 gold plated in accordance with mil-g-45204, type ii, .00030 min. thick gold over .000050 min. thick nickel 5 tin plated in accordance with astm b545, .00010 min. thick matte tin over .00010 min. thick nickel 6 tin-lead plated in accordance with sae-ams-p-81728, .00010 min. thick tin-lead over .00010 min. thick copper
4 recommended mother board layout recommended daughter board layout no. of contacts b 40 1.075 80 1.775 120 2.475 160 3.175 dimensions b .070 .060 .205 .035 .030 finished hole size per customer standards for a .016 pcb tail .005 m .110 .005 b .025 . 300 .150 .205 .070 .035 .060 finished hole size per customer standards for a .016 pcb tail board edge .005 m .110 .005 mother board connector keying (optional) daughter board connector keying (optional) .680 .620 .560 .500 mother board daughter board mother board connector daughter board connector mated connector pair assembled to boards (0.68 0? total mated height)
5 connector comparison the amphenol hdb 3 connector offers advantages over competitive connectors: ? higher density contact pattern ? uses less board space ? allows for shorter mated height ? provides the durability and performance of the brush contact ? low cost contact system brush hyperboloid pin & socket durability, mating cycles 100,000 2,000 500 contact mating forces, ounces 1.5 1.5 2.5 mother board .070 x .060 .075 x .075 .075 x .070 daughter board .070 x .060 .075 x .100 .075 x .100 connector width .350 .443 .400 mated height, mb to 4th row of db . 680 .986 .915 contacts 40 29 80 38 86 37 102 37 120 43 110 40 160 46 164 40 amphenol hypertronics airborn hdb 3 hph rm4 notice: specifications are subject to change without notice. contact your nearest amphenol corporation sales office for the latest spe cifications. all statements, information and data given herein are believed to be accurate and reliable but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. the user should assume that all safety measures are indicated or that other measures may not be required. specifications are typical and may not apply to all connectors. amphenol is a registered trademark of amphenol corporation. for additional information on this product or other amphenol products contact: amphenol corporation amphenol aerospace 40-60 delaware avenue sidney, new york 13838-1395 phone: 800-678-0141 and ask for blp (board level product) marketing email: blp-marketing @amphenol-aerospace.com web: www.amphenol-aerospace.com see amphenol low mating force rectangular connectors catalog, 12-035. contact arrangement contacts per linear inch (contacts/ connector length)
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